PART |
Description |
Maker |
AS4C32M16MD1A AS4C32M16MD1A-5BCN |
60 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
NP291-04812-2-AC-14680 NP291-04812-2-G4-BF NP291-0 |
Fine Ball Grid Array (FBGA, 0.75mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
1-54-712 1-54-724 1-54-716 1-54-732 1-54-708 |
HAMMER BALL PEIN 12OZ HAMMER BALL PEIN 24OZ HAMMER BALL PEIN 32OZ HAMMER BALL PEIN 8OZ HAMMER BALL PEIN 16OZ 锤球石工16安士
|
ITT, Corp.
|
MT29C4G48MAZAPAKD-5IT |
NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP? MT29C Family
|
Micron Technology
|
M3H71FAD-R M3H15TDD M3H52TCD-R MH75FBD MH75FAG MH7 |
8 pin DIP, 3.3 or 5.0 Volt, HCMOS/TTL Clock Oscillator 16-bit, 75 MIPS, 2.5v, 2 serial ports, host port, 80 KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Ind 16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 20KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm. 16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 80KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Ind 16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 80KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm. 16-Bit, 75 MIPS, 2.5V, 2 Serial Ports, Host Port, 40 KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm. 500 MHz TigerSHARC Processor with 12 Mbit on-chip embedded DRAM; Package: 576 ball SBGA; No of Pins: 576; Temperature Range: Ind 300 MHz TigerSHARC Processor with 6 Mbit on-chip SRAM; Package: 625 ball BGA; No of Pins: 625; Temperature Range: Ind 500 MHz TigerSHARC Processor with 12 Mbit on-chip embedded DRAM; Package: BGA THERM ENH W/ HEATSINK; No of Pins: 576; Temperature Range: Ind 300 MHz TigerSHARC Processor with 6 Mbit on-chip SRAM; Package: 484 ball BGA; No of Pins: 484; Temperature Range: Ind 8 pin DIP, 3.3 or 5.0 Volt, HCMOS/TTL Clock Oscillator
|
MTRONPTI
|
BC-148 |
148-Lead Chip Scale Package Ball Grid Array
|
Analog Devices, Inc. AD[Analog Devices]
|
ECG2364 ECG2370 ECG2365 |
FAN AC 80X25 115/220V BALL, 18cfm FAN AC 80X25 220V BALL, 25cfm FAN AC 80X25 115/220V BALL, 13cfm 晶体管|晶体管|叩| 800V的五(巴西)总裁| 12A条一(c)|47VAR
|
EPCOS AG
|
BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
CY14B104N-ZS20XCT CY14B104N-ZS20XI CY14B104N-ZS20X |
4 Mbit (512K x 8/256K x 16) nvSRAM; Organization: 512Kb x 8; Vcc (V): 2.7 to 3.6 V; Density: 4 Mb; Package: FBGA
|
CYPRESS SEMICONDUCTOR CORP http://
|
V53C1256162VALS10 V53C1256162VALS10E V53C1256162VA |
256Mbit MOBILE SDRAM 2.5 VOLT FBGA PACKAGE 16M X 16 256Mbit MOBILE SDRAM 2.5 VOLT FBGA PACKAGE 16M X 16
|
List of Unclassifed Manufacturers List of Unclassifed Man...
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LC5768VG-10F484I LC5768VG-10F256I LC5768VG-10F256C |
EE PLD, 12 ns, PBGA484 FBGA-484 EE PLD, 12 ns, PBGA256 FBGA-256 EE PLD, 10 ns, PBGA676 FBGA-676 EE PLD, 10 ns, PBGA484 FBGA-484 EE PLD, 10 ns, PBGA256 FBGA-256 EE PLD, 5 ns, PBGA256 FBGA-256 EE PLD, 5 ns, PBGA484 FBGA-484 EE PLD, 7.5 ns, PBGA484 FBGA-484 EE PLD, 7.5 ns, PBGA256 FBGA-256
|
Lattice Semiconductor, Corp. Lattice Semiconductor Corporation
|
K4S51153PF-YF K4S51153PF K4S51153PF-YPF1L K4S51153 |
32M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 FBGA-54 8M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 8米16 × 4银行4FBGA移动SDRAM 32M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54 FBGA-54 From old datasheet system
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Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
|