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AS4C32M16MD1A - 60 ball FBGA PACKAGE

AS4C32M16MD1A_9061635.PDF Datasheet


 Full text search : 60 ball FBGA PACKAGE


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PART Description Maker
AS4C32M16MD1A AS4C32M16MD1A-5BCN 60 ball FBGA PACKAGE
Alliance Semiconductor ...
NP291-04812-2-AC-14680 NP291-04812-2-G4-BF NP291-0 Fine Ball Grid Array (FBGA, 0.75mm Pitch)
Yamaichi Electronics Co., Ltd.
1-54-712 1-54-724 1-54-716 1-54-732 1-54-708 HAMMER BALL PEIN 12OZ
HAMMER BALL PEIN 24OZ
HAMMER BALL PEIN 32OZ
HAMMER BALL PEIN 8OZ
HAMMER BALL PEIN 16OZ 锤球石工16安士
ITT, Corp.
MT29C4G48MAZAPAKD-5IT NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP? MT29C Family
Micron Technology
M3H71FAD-R M3H15TDD M3H52TCD-R MH75FBD MH75FAG MH7 8 pin DIP, 3.3 or 5.0 Volt, HCMOS/TTL Clock Oscillator
16-bit, 75 MIPS, 2.5v, 2 serial ports, host port, 80 KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Ind
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 20KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 80KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Ind
16-Bit, 80MIPS, 1.8V, 2 Serial Ports, Host Port, 80KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
16-Bit, 75 MIPS, 2.5V, 2 Serial Ports, Host Port, 40 KB RAM; Package: 144 ball CSPBGA (10x10x1.4mm); No of Pins: 144; Temperature Range: Comm.
500 MHz TigerSHARC Processor with 12 Mbit on-chip embedded DRAM; Package: 576 ball SBGA; No of Pins: 576; Temperature Range: Ind
300 MHz TigerSHARC Processor with 6 Mbit on-chip SRAM; Package: 625 ball BGA; No of Pins: 625; Temperature Range: Ind
500 MHz TigerSHARC Processor with 12 Mbit on-chip embedded DRAM; Package: BGA THERM ENH W/ HEATSINK; No of Pins: 576; Temperature Range: Ind
300 MHz TigerSHARC Processor with 6 Mbit on-chip SRAM; Package: 484 ball BGA; No of Pins: 484; Temperature Range: Ind
   8 pin DIP, 3.3 or 5.0 Volt, HCMOS/TTL Clock Oscillator
MTRONPTI
BC-148 148-Lead Chip Scale Package Ball Grid Array
Analog Devices, Inc.
AD[Analog Devices]
ECG2364 ECG2370 ECG2365 FAN AC 80X25 115/220V BALL, 18cfm
FAN AC 80X25 220V BALL, 25cfm
FAN AC 80X25 115/220V BALL, 13cfm 晶体管|晶体管|叩| 800V的五(巴西)总裁| 12A条一(c)|47VAR
EPCOS AG
BGA-320P-M06 PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
Fujitsu Limited
CY14B104N-ZS20XCT CY14B104N-ZS20XI CY14B104N-ZS20X 4 Mbit (512K x 8/256K x 16) nvSRAM; Organization: 512Kb x 8; Vcc (V): 2.7 to 3.6 V; Density: 4 Mb; Package: FBGA
CYPRESS SEMICONDUCTOR CORP
http://
V53C1256162VALS10 V53C1256162VALS10E V53C1256162VA 256Mbit MOBILE SDRAM 2.5 VOLT FBGA PACKAGE 16M X 16
   256Mbit MOBILE SDRAM 2.5 VOLT FBGA PACKAGE 16M X 16
List of Unclassifed Manufacturers
List of Unclassifed Man...
LC5768VG-10F484I LC5768VG-10F256I LC5768VG-10F256C EE PLD, 12 ns, PBGA484 FBGA-484
EE PLD, 12 ns, PBGA256 FBGA-256
EE PLD, 10 ns, PBGA676 FBGA-676
EE PLD, 10 ns, PBGA484 FBGA-484
EE PLD, 10 ns, PBGA256 FBGA-256
EE PLD, 5 ns, PBGA256 FBGA-256
EE PLD, 5 ns, PBGA484 FBGA-484
EE PLD, 7.5 ns, PBGA484 FBGA-484
EE PLD, 7.5 ns, PBGA256 FBGA-256
Lattice Semiconductor, Corp.
Lattice Semiconductor Corporation
K4S51153PF-YF K4S51153PF K4S51153PF-YPF1L K4S51153 32M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 FBGA-54
8M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 8米16 × 4银行4FBGA移动SDRAM
32M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54 FBGA-54
From old datasheet system
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
 
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